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Introduction:
As portable electronic products such as mobile phones and computers become thinner, smaller, and higher-performance, IC packaging is also becoming smaller and more highly aggregated. CSP/BGA is rapidly popularized and applied, and CSP/BGA packaging process requirements are also increasing. taller and taller. The role of insulation aerogel silica is also increasingly valued. BGA and CSP are fixed on the circuit board by fine solder balls. If they are affected by external forces such as impact and bending, the soldered parts are prone to breakage. The characteristics of insulation aerogel silica are: rapid movement, rapid curing, can quickly penetrate to the bottom of BGA and CSP, has excellent filling performance, after curing, it can relax the temperature shock and absorb internal stress, and strengthen the connection between BGA and the substrate. This function greatly enhances the reliability of the connection. This is because the BGA aerogel is used to fill the BGA/CSP to make it more firmly bonded to the PBC board.
Specifications :
Material structure: SiO2 and glass fiber
Thickness: 3mm 6mm 10mm (customized)
Size/roll Normal size: 1.5m*16.7-38m
The maximum width is 1.5m
Hydrophobicity: 96%-97%
Thermal conductivity: 0.017 m2w/k
Density: 210±10kg/m3
Application: Pipeline/Construction/Automotive
Features:
1. Low thermal conductivity and low heat capacity
2. Excellent hydrophobic properties
3. Excellent acoustic noise reduction
4. Environmentally friendly and non-toxic raw materials.
5. Good flexibility, stretchability and compressibility.
6. High strength and low density
7. Long service life
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